Soldering Lead (500g)
Overview
The Soldering Lead (500g) is a high-quality soldering material designed for various electronics and IoT applications. This lead-based solder is a essential component for assembling, repairing, and prototyping electronic circuits, PCBs, and other electronic devices.
Functionality
The primary function of the Soldering Lead (500g) is to provide a strong, reliable, and conductive bond between electronic components and PCBs. The soldering process involves melting the solder alloy to form a strong mechanical and electrical connection between the components and the board. The Soldering Lead (500g) is designed to facilitate this process, ensuring a reliable and long-lasting connection.
Key Features
- Composition: The Soldering Lead (500g) is a lead-based alloy, consisting of 60% tin and 40% lead. This composition provides a low melting point, excellent wetting properties, and high tensile strength.
- Melting Point: The solder has a melting point of 183C (361F), making it suitable for a wide range of soldering applications.
- Flux Core: The solder has a flux core, which helps to remove oxidation and other impurities from the surface of the components and PCB, ensuring a strong and reliable bond.
- 500g Weight: The solder is packaged in a 500g spool, providing a sufficient amount of material for various projects and applications.
- Diameter: The solder has a diameter of 0.8mm (0.032 inches), making it suitable for most soldering irons and applications.
- Lead-Free Option: The Soldering Lead (500g) is available in a lead-free version, making it compliant with RoHS (Restriction of Hazardous Substances) regulations.
Specifications