2cmx1.5cm Heat Sink(Pack of 5) Documentation

Component Name

2cmx1.5cm Heat Sink (Pack of 5)

Overview

The 2cmx1.5cm Heat Sink is a compact, high-performance heat dissipation component designed to efficiently cool electronic devices, particularly in IoT applications where space is limited. This pack of 5 heat sinks is ideal for prototyping, development, and production of various IoT projects.

Functionality

The primary function of the 2cmx1.5cm Heat Sink is to dissipate heat generated by electronic components, such as microcontrollers, voltage regulators, and other devices, to maintain their optimal operating temperatures. This is achieved through convection, where the heat sink absorbs heat from the component and dissipates it into the surrounding air. By effectively managing heat, the heat sink helps to

Prevent overheating, which can cause device failure or malfunction

Reduce the risk of thermal runaway

Increase the overall reliability and lifespan of the device

Improve system performance and efficiency

Key Features

Compact Size: The 2cmx1.5cm Heat Sink is designed to fit in small spaces, making it perfect for IoT applications where miniaturization is crucial.
High Thermal Conductivity: The heat sink is made from a material with high thermal conductivity, ensuring efficient heat transfer and dissipation.
Low Profile: The heat sink's low profile allows for easy mounting and installation in tight spaces, without compromising thermal performance.
Durable Construction: The heat sink is built with durable materials to withstand the rigors of continuous operation and environmental stress.
Easy Installation: The heat sink features a simple, screw-mount design, making it easy to install and secure onto the target device.
Pack of 5: The heat sink is supplied in a pack of 5, providing a convenient and cost-effective solution for developers and manufacturers.

Dimensions

2cm x 1.5cm x 0.5cm (L x W x H)

Material

High-thermal-conductivity aluminum alloy

Thermal Resistance

10C/W

Operating Temperature Range

-40C to 150C

Surface Finish

Anodized aluminum

Application Ideas

IoT devices and sensors

Microcontrollers and single-board computers

Voltage regulators and power management ICs

Audio amplifiers and RF modules

LED drivers and lighting systems

Conclusion

The 2cmx1.5cm Heat Sink (Pack of 5) is a reliable, high-performance thermal management solution for a wide range of IoT applications. Its compact size, high thermal conductivity, and durable construction make it an ideal choice for developers, manufacturers, and hobbyists alike.

Pin Configuration

Component Documentation: 2cmx1.5cm Heat Sink (Pack of 5)
Overview:
The 2cmx1.5cm Heat Sink is a compact heat dissipation component designed for efficient thermal management in IoT devices, robotics, and other electronic systems. This pack of 5 heat sinks is ideal for prototyping, development, and production applications.
Pinout and Connection Guide:
The heat sink has no pins, as it is a passive component designed for thermal conduction. Instead, it is attached to a heat-generating component (e.g., IC, transistor, or diode) using a thermally conductive adhesive, thermal tape, or a mechanical fastening system.
Connection Structure:
1. Surface Preparation:
Ensure the heat-generating component's surface is clean and free of dirt, oils, or other contaminants.
Apply a thin layer of thermal interface material (TIM) or thermal grease to the component's surface, if recommended by the manufacturer.
2. Heat Sink Attachment:
Place the heat sink on top of the heat-generating component, aligning the flat surfaces.
Apply gentle pressure to ensure good contact between the heat sink and the component.
Use a thermally conductive adhesive or thermal tape to secure the heat sink in place, if required.
For mechanical fastening, use screws or clips according to the manufacturer's instructions.
Important Considerations:
Ensure the heat sink is compatible with the heat-generating component's operating temperature range.
Follow proper thermal interface material (TIM) or thermal grease application guidelines to prevent overheating.
Avoid using excessive force when attaching the heat sink, as this may damage the component or the heat sink itself.
Additional Tips:
For optimal heat dissipation, ensure good airflow around the heat sink and the entire system.
Consider using a heat sink with a higher thermal conductivity rating for more efficient heat dissipation.
When using thermal tape or adhesive, ensure the bonding process is done according to the manufacturer's instructions to prevent thermal resistance.
By following these guidelines, you can effectively attach the 2cmx1.5cm Heat Sink to your heat-generating component and ensure efficient thermal management in your IoT device or electronic system.

Code Examples

Component Documentation: 2cmx1.5cm Heat Sink (Pack of 5)

Overview

The 2cmx1.5cm Heat Sink is a compact, high-performance heat dissipation solution designed for IoT applications. This pack of 5 heat sinks is ideal for thermal management in small form factor devices, such as:

Microcontrollers
 Sensors
 Voltage Regulators
 LEDs
 Small Power Amplifiers

Features

Compact size: 2cm x 1.5cm (0.8" x 0.6")
 High thermal conductivity: efficient heat dissipation
 Lightweight and compact design
 Easy to install and integrate into IoT projects

Technical Specifications

Material: Aluminum alloy
 Fin density: 20 fins/inch
 Thermal resistance: 10C/W
 Maximum operating temperature: 150C (302F)

Using the 2cmx1.5cm Heat Sink in IoT Projects

Here are three code examples demonstrating the use of the 2cmx1.5cm Heat Sink in various IoT contexts:

Example 1: Arduino-Based Temperature Monitoring

In this example, we'll use the 2cmx1.5cm Heat Sink to dissipate heat from a DS18B20 digital temperature sensor connected to an Arduino Uno board.

```c
#include <DallasTemperature.h>

#define ONE_WIRE_BUS 2 // GPIO 2 for DS18B20

OneWire oneWire(ONE_WIRE_BUS);
DallasTemperature sensors(&oneWire);

void setup() {
  Serial.begin(9600);
  sensors.begin();
}

void loop() {
  sensors.requestTemperatures();
  float tempC = sensors.getTempCByIndex(0);
  Serial.print("Temperature: ");
  Serial.print(tempC);
  Serial.println("C");
  delay(1000);
}
```

Hardware Connection:

Connect the DS18B20 sensor to the Arduino Uno's GPIO 2.
 Mount the 2cmx1.5cm Heat Sink on top of the DS18B20 sensor using thermal tape or adhesive.

Example 2: ESP32-Based WiFi Weather Station

In this example, we'll use the 2cmx1.5cm Heat Sink to dissipate heat from an ESP32 microcontroller, which is connected to a BME280 temperature and humidity sensor, and a WiFi module.

```c
#include <WiFi.h>
#include <BME280I2C.h>

#define BME280_ADDRESS 0x76

BME280I2C bme;

void setup() {
  Serial.begin(115200);
  WiFi.begin(ssid, password);
  while (WiFi.status() != WL_CONNECTED) {
    delay(1000);
    Serial.println("Connecting to WiFi...");
  }
  Serial.println("Connected to WiFi");
  bme.begin();
}

void loop() {
  float temp = bme.readTemperature();
  float humi = bme.readHumidity();
  Serial.print("Temperature: ");
  Serial.print(temp);
  Serial.println("C");
  Serial.print("Humidity: ");
  Serial.print(humi);
  Serial.println("%");
  delay(10000);
}
```

Hardware Connection:

Connect the BME280 sensor to the ESP32's I2C pins.
 Connect the WiFi module to the ESP32's GPIO pins.
 Mount the 2cmx1.5cm Heat Sink on top of the ESP32 microcontroller using thermal tape or adhesive.

These code examples demonstrate the versatility of the 2cmx1.5cm Heat Sink in various IoT applications, ensuring efficient heat dissipation and reliable performance.