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Description: 1. Size and Dimensions: Measuring 9x9x12mm, this Aluminum Cooling Heat Sink is specifically designed for Chip RAM modules in Reprap StepStick projects or similar electronic applications. 2. Material: Crafted from high-quality aluminum, the heat sink offers superior thermal conductivity and heat dissipation, which is essential to maintain optimal operating temperatures for Chip RAM components. 3. Design: The heat sink features a unique fin design that increases its surface area and enhances its cooling efficiency. This allows it to dissipate more heat per unit area compared to flat aluminum plates or other less efficient designs. 4. Compatibility: Suitable for Chip RAM modules with dimensions up to 10x10mm, this heat sink is widely used in various Reprap 3D printer projects where high-performance cooling is essential for stable operation and longer component lifespan. 5. Installation: The heat sink can be attached to the Chip RAM module using thermal paste or clips, depending on th
| Specification | Details |
|---|---|
| Material | High-quality aluminum (95%+) |
| Size | 9x9x12mm |
| Color | Blue |
| Fin Density | Optimized for maximum heat dissipation |
| Thermal Resistance | ≤1.5°C/W |
| Operating Temperature | -40°C to 120°C |
| Insulation | Epoxy-based thermal insulation |
| Mounting Options | Screws or adhesive (included) |
| Compatibility | Compatible with Reprap StepStick |
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