Stufin
Home Quick Cart Profile

Heat Sink (finger type)

Heat Sink (finger type) Heat Sink (finger type)
Buy Now

Material

Aluminum or Copper

Fin Thickness

0.5-2.0 mm

Fin Spacing

1-5 mm

Base Thickness

1-5 mm

Operating Temperature Range

-40C to 150C

Thermal Resistance

0.5-5C/W

Dimensions

Variable (dependent on application and design)

Applications

Electronic devices and components (e.g., CPUs, GPUs, power supplies)

Automotive systems (e.g., engine control units, battery management systems)

Aerospace and defense systems (e.g., avionics, radar systems)

Industrial control systems (e.g., motor drives, power supplies)

Medical devices and equipment (e.g., medical imaging, patient monitoring systems)

Conclusion

The heat sink (finger type) is a reliable and efficient thermal management component, well-suited for a wide range of applications. Its compact design, high thermal conductivity material, and ease of installation make it an ideal solution for engineers and designers seeking to mitigate thermal-related issues in their designs.

Pin Configuration

  • Heat Sink (Finger Type) Documentation
  • Introduction
  • A heat sink is a critical component in electronic devices that helps to dissipate heat generated by high-power components, ensuring reliable operation and preventing overheating. The finger type heat sink is a popular design that features multiple thin, rectangular protrusions (fingers) to increase the surface area for heat dissipation.
  • Pinout Diagram
  • The following diagram illustrates the pinout of a typical heat sink (finger type):
  • ```
  • +---------------+
  • | 1 | 2 | 3 |
  • +---------------+
  • | 4 | 5 | 6 |
  • +---------------+
  • ```
  • Pin Description
  • Here's a detailed description of each pin:
  • 1. Mounting Hole (MH)
  • Function: Provides a secure mounting point for the heat sink to the PCB or chassis.
  • Type: Through-hole or threaded hole for screw-based mounting.
  • Recommended practice: Use a thermal interface material (e.g., thermal tape or grease) between the heat sink and the component being cooled.
  • 2. Heat Sink Tab (HST)
  • Function: The tab is the flat surface where the heat source (e.g., IC, transistor, or diode) is attached.
  • Type: Flat, rectangular surface with a thermal interface material (e.g., thermal tape or grease) applied.
  • Recommended practice: Ensure a clean, flat surface for optimal heat transfer.
  • 3. No Connection (NC)
  • Function: No electrical connection is made to this pin.
  • Type: Unpinned area on the heat sink.
  • 4. Heat Sink Finger (HSF1)
  • Function: One of multiple fingers on the heat sink that increase the surface area for heat dissipation.
  • Type: Thin, rectangular protrusion from the heat sink tab.
  • 5. Heat Sink Finger (HSF2)
  • Function: Another finger on the heat sink that increases the surface area for heat dissipation.
  • Type: Thin, rectangular protrusion from the heat sink tab.
  • 6. Heat Sink Finger (HSF3)
  • Function: A third finger on the heat sink that increases the surface area for heat dissipation.
  • Type: Thin, rectangular protrusion from the heat sink tab.
  • Connecting the Pins
  • To properly connect the pins, follow these steps:
  • Mount the heat sink to the PCB or chassis using a screw or adhesive, ensuring the heat sink tab is securely attached to the component being cooled.
  • Apply a thermal interface material (e.g., thermal tape or grease) to the heat sink tab.
  • Attach the heat source (e.g., IC, transistor, or diode) to the heat sink tab, ensuring good thermal contact.
  • Leave the no connection (NC) pin untouched.
  • The heat sink fingers (HSF1, HSF2, HSF3, etc.) do not require any electrical connections; they are designed for heat dissipation only.
  • Important Considerations
  • Ensure proper thermal contact between the heat sink and the component being cooled.
  • Use a suitable thermal interface material to minimize thermal resistance.
  • Select a heat sink with a sufficient number of fingers and a suitable material (e.g., aluminum or copper) for efficient heat dissipation.
  • Avoid bending or warping the heat sink fingers, as this can reduce their effectiveness.
  • By following these guidelines, you can effectively utilize a heat sink (finger type) to manage heat in your IoT project, ensuring reliable operation and preventing overheating.

Code Examples

Heat Sink (Finger Type) Documentation
Overview
A heat sink is a component designed to efficiently dissipate heat generated by electronic devices, such as CPUs, GPUs, and other high-power components. The finger type heat sink is a popular design that features multiple thin, flat fins that increase the surface area, allowing for more effective heat dissipation.
Technical Specifications
Material: Aluminum or Copper
 Fin density: 20-40 fins per inch
 Fin thickness: 0.5-1.5 mm
 Base thickness: 2-5 mm
 Dimensions: varies depending on application (e.g., 20x20x10 mm, 30x30x15 mm)
 Thermal resistance: 0.5-1.5 C/W
 Operating temperature range: -40C to 150C
Connecting the Heat Sink
To connect the heat sink to a device, a thermal interface material (TIM) such as thermal paste or thermal tape is typically applied to the base of the heat sink. The heat sink is then attached to the device using screws, clips, or adhesive.
Code Examples
### Example 1: Arduino Temperature Monitoring with Heat Sink
In this example, we'll use an Arduino Uno board to monitor the temperature of a CPU or other high-power device using a DS18B20 temperature sensor. We'll attach the heat sink to the device to prevent overheating.
```c
#include <OneWire.h>
#include <DallasTemperature.h>
// Define the pin for the temperature sensor
#define ONE_WIRE_BUS 2
OneWire oneWire(ONE_WIRE_BUS);
DallasTemperature sensors(&oneWire);
void setup() {
  Serial.begin(9600);
  sensors.begin();
}
void loop() {
  sensors.requestTemperatures();
  float temp = sensors.getTempCByIndex(0);
if (temp > 60) { // Alert if temperature exceeds 60C
    Serial.println("Temperature exceeds 60C! Heat sink is working.");
  } else {
    Serial.print("Temperature: ");
    Serial.print(temp);
    Serial.println("C");
  }
delay(1000);
}
```
### Example 2: Raspberry Pi Cooling System with Heat Sink
In this example, we'll create a simple cooling system for a Raspberry Pi using a heat sink and a fan. We'll use Python to monitor the CPU temperature and control the fan speed.
```python
import os
import temperature
# Define the fan pin and temperature threshold
FAN_PIN = 17
TEMP_THRESHOLD = 60
# Set up the fan pin as an output
os.system("gpio -g mode " + str(FAN_PIN) + " out")
while True:
  temp = temperature.get_cpu_temperature()
if temp > TEMP_THRESHOLD:
    # Turn on the fan if the temperature exceeds the threshold
    os.system("gpio -g write " + str(FAN_PIN) + " 1")
    print("Fan on: Temperature exceeds " + str(TEMP_THRESHOLD) + "C")
  else:
    # Turn off the fan if the temperature is within the safe range
    os.system("gpio -g write " + str(FAN_PIN) + " 0")
    print("Fan off: Temperature is within safe range")
time.sleep(1)
```
Note: These examples are for illustrative purposes only and may require modifications to suit your specific use case. Ensure proper connection and installation of the heat sink and other components to avoid damage or injury.