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Description: 1. A finger-type heat sink is a passive cooling component in electronic systems, designed with fins resembling human fingers to increase the surface area for efficient heat dissipation. 2. Construction: Made primarily of aluminum or copper, these heat sinks feature thin, vertically arranged fins that facilitate airflow over the hot components, minimizing thermal resistance and promoting efficient cooling. 3. Size and Shape: Finger-type heat sinks come in various sizes and shapes to accommodate different electronic components, with dimensions typically ranging from 1-inch to several inches high and wide, and lengths extending beyond the components they cool. 4. Thermal Conductivity: The material used in finger-type heat sinks offers excellent thermal conductivity, allowing them to efficiently draw heat away from electrical components and transfer it to the surrounding environment for dissipation. 5. Improved Airflow: Their finned structure enhances natural convection by increasing
| Specification | Details |
|---|---|
| Material | Aluminum or Copper alloy |
| Finish | Nickel-plated or bare finish |
| Thermal Resistance | 0.2-1.5°C/W depending on the application |
| Size (L x W x H) | Various sizes available: e.g. 25x20x6mm 40x30x10mm etc. |
| Mounting Type | Pin-fin or clip-on for easy installation |
| Operating Temperature | -55°C to 150°C (or -65°C to 200°C in some cases) |
| Weight | Lightweight design: typically <100 grams |
| Heat Dissipation Capacity | Up to 50 W or more depending on the size and material used |
| Certifications | RoHS compliant UL certified (in some cases) |
