Description: 1. The 1660-TI Solderless Breadboard is a versatile and large-format solution for prototyping and building electronic projects in the Internet of Things (IoT) domain. 2. It features a grid layout with 384 tie points arranged in 20 rows and 18 columns, allowing ample space for complex circuit designs and accommodating larger components like microcontrollers, sensors, or power supplies. 3. This solderless breadboard boasts a high-density design, making it suitable for projects that demand more connections and pins than standard breadboards can offer while minimizing the need for wire jumping. 4. The tie points on this breadboard are self-aligning, ensuring proper component placement and reducing the risk of errors during assembly. 5. It incorporates a power bus system with individual power and ground rails for each row. This feature helps minimize clutter by enabling you to power multiple components directly from their respective rows. 6. The 1660-TI breadboard is made from flame-r
| Specification | Details |
|---|---|
| Tie-points | 160 (2 x 80 or 10 x 16) |
| Board size | 5.6" x 2.2" (14.2 cm x 5.6 cm) |
| Pitch | 0.1" (2.54 mm) |
| Material | High-quality Solderless Breadboard |
| Power rating | Up to 10A per tie-point (20W max.) |
| Temperature range | -40°C to +60°C (+-40°F to +140°F) |
| Dimensions | 6.8" x 2.4" x 0.1" (17.3 cm x 6.1 cm x 2.5 mm) |
| Weight | Approximately 2 oz (57g) |
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