Description: 1. Size and Capacity: The 400-Tie Point Solderless Breadboard offers a large working area with 400 ties points, allowing the accommodation of up to 250 components for prototyping complex IoT projects. 2. Flexible Design: Its solderless design enables easy assembly and disassembly of circuits without damaging components or the breadboard itself, making it an ideal choice for rapid prototyping in the IoT realm. 3. Insulation Properties: Each tie point on this breadboard is insulated to prevent electrical shorts and reduce noise, ensuring reliable and stable circuit functioning during IoT experiments. 4. Power Distribution: It comes with 29 power distribution points, providing easy access for voltage application to circuits and ensuring efficient power delivery for a wide range of IoT components. 5. Signal Integrity: The 400-Tie Point Solderless Breadboard features bus strips that ensure high signal integrity by minimizing resistance, enabling the transmission of clear and stable sig
| Specification | Details |
|---|---|
| Number of Tie Points | 400 tie points for easy prototyping |
| Grid Size | 0.1 inch (2.54 mm) grid spacing |
| Material | High-quality plastic or epoxy board |
| Thickness | Approximately 3-4 mm |
| Weight | Lightweight approximately 50 grams |
| Size | Standard breadboard size: 7.5 x 2.5 inches (19.1 x 6.35 cm) |
| Solderless Design | Easy to use without soldering required |
| Compatibility | Works with various microcontrollers and components |
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