Description: 1. Soldering Paste (50gm) is a high-performance solder material specifically designed for SMT (Surface Mount Technology) assembly in IoT components and electronics manufacturing. 2. The paste consists of fine metallic particles suspended in a rosin flux, which promotes wetting and forms a strong bond between the component pads and the tin-lead or lead-free solder. 3. It is available in different sizes and shapes to cater to various SMT component geometries and requirements in IoT projects. 4. Soldering Paste (50gm) offers excellent reflow properties, ensuring consistent solder joints and minimal voiding during the soldering process. 5. Its low viscosity allows for easy dispensing and precise application using stencils or screen printing techniques, reducing waste and improving overall manufacturing efficiency. 6. The paste has a long shelf life due to its advanced preservative system, ensuring consistent product quality over an extended period. 7. It is suitable for various sold
| Specification | Details |
|---|---|
| Net Weight | 50 grams |
| Material Composition | Tin-Silver-Copper (Sn63/Pb37 Cu) |
| Viscosity | Medium to High |
| Flash Point | Non-flammable |
| Working Temperature | 350°F - 400°F (175°C - 200°C) |
| Storage Conditions | Room temperature dry place |
| Shelf Life | 12 months from date of manufacture |
| Packaging | Plastic syringe with cap |
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