Non-Corrosive Soldering Paste Flux (500g)

Stufin

Non-Corrosive Soldering Paste Flux (500g)

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Description: 1. Non-Corrosive Soldering Paste Flux (500g) is a high-performance soldering aid specifically designed for use in various IoT components, electronics assembly, and rework applications. 2. Features: This flux is non-corrosive, meaning it prevents oxidation during the soldering process and leaves no residue behind, ensuring a cleaner and more reliable joint connection. It also exhibits excellent wetting properties, enhancing the flow of solder to hard-to-reach areas. 3. Composition: The flux is composed of rosin-activated, low-residue, and water-soluble materials for increased versatility and ease of use, making it suitable for various soldering techniques such as through-hole, surface mount, and rework applications. 4. Electrochemical Compatibility: The non-corrosive flux offers superior electrochemical compatibility with various metals commonly used in IoT components, including copper, nickel, tin, and gold, ensuring a longer lifespan of the solder joints. 5. RoHS & Waste Manageme

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Specification	Details
Net Weight	500 grams
Volume	Approximately 1200 milliliters
Consistency	Thixotropic paste
Temperature Range	Suitable for use between -20°C and +150°C
Shelf Life	Minimum of 24 months from date of manufacture
Chemical Composition	Non-corrosive lead-free formula
pH Level	Neutral (pH value: 7 ± 1)
Viscosity	2000-3000 centipoise at +20°C
Surface Tension	Approximately 25 dynes/cm at +20°C
Electrical Properties	Non-conductive